A leading independent provider of assembly and test services for a broad range of semiconductor chips (also known as integrated circuits) with diversified end-uses, including in communications devices (such as smartphones, Bluetooth and WiFi), consumer devices, computing devices, automotive applications and industrial and medical applications. We believe our diversity across end-markets positions us well to benefit from the growing proliferation of connectivity between devices, also known as the Internet of Things.
Lead Underwriter
BofA Merrill Lynch,Citigroup Global Markets Inc,Credit Suisse Securities (USA) LLC
