Our mission is to innovate, design, and deliver semiconductor-based connectivity solutions that are purpose-built to unleash the full potential of cloud and AI infrastructure.Building on years of experience with a singular focus on addressing connectivity challenges in data-centric systems, we have developed and deployed our leading Intelligent Connectivity Platform built from the ground up for cloud and AI infrastructure. Our Intelligent Connectivity Platform comprises: i) Semiconductor-based, high-speed, mixed-signal connectivity products that integrate a matrix of microcontrollers and sensors; and ii) COSMOS, our software suite which is embedded in our connectivity products and integrated into our customers’ systems.
Lead Underwriter
J.P. Morgan Securities LLC,Morgan Stanley & Co. LLC
Co-Managers
Barclays Capital Inc,Craig-Hallum Capital Group LLC,Deutsche Bank Securities Inc,Evercore Group L.L.C,Jefferies LLC,Needham & Company, LLC,Roth Capital Partners, LLC,Stifel Nicolaus & Company, Incorporated